| New Product MSS1P5, MSS1P6 \@ Vishay General Semiconductor 7 THERMAL cHARAcTERIsTIcS (TA = 25 0C unless othemise noted) PARAMETER Typical thermal resistance N ate‘ll Thermal resistance from junction to ambient and junction to lead mounted on PCB with 6.0 mm x 6.0 mm copper pad areas RHJL is measured at the terminal of cathode band. Rene is measured at the top center of the body ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (9) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE Mss1Pe-M3/89A mm ZR— MSS1P6HM3/89A(‘l W T 7" diameter plastic tape and reel Note‘ll Automotive grade RATINGS AND cHARAcTERIsTIcs CURVES(TA : 25 °C unless otherwise noted) 1.2 100.1 Average Fonivard Rectified Current (A) Instantaneous Forward Current (A) at the Cathode 0.01 0 25 50 75 I00 125 150 0 or 0.2 0.3 0.4 0.5 0 6 0.7 0.5 0.9 1.0 I I 1.2 Lead Temperature (UC) Instantaneous Forward Voltage (V)Fig. 1 - Maximum Forward Current Derating Cun/e Fig. 3 - Typical Instantaneous Forward Characteristics 1000 2\E? 100g 5 to E E E 3 u) 5§ at ‘u) U) E 3 0.1 3% EE 0 mE 0.00‘ 0 0.2 0.4 0 6 0 E In ‘.2Average Forward Current (A) Percent of Rated Peak Reverse Voltage (°/e) Fig. 2 - Forward Power Loss Characteristics Fig. 4 - Typical Reverse Characteristics www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 89018 2 DiodesAmerieas@vishay.com, DiodesAs|a@vishay.eom, DiodesEuroge@vishay_com Revision: 19-Apr-11 This document is subject to change without notice. THE PRODUCTS DESCRiBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECiFiC DISCLAiMERS, SET FORTH AT www_vishay.com/doc?91 000 |